The Wafer Inspection Equipment that is essential to maintaining semiconductor yields
During the manufacture of semiconductor wafers, wafer inspection equipment is utilised to detect faults. By getting the coordinates of the defect's position, this technology detects both pattern and physical faults. Wafer inspection's primary function is to detect faults on a wafer and determine their location coordinates. Wafer inspection equipment aids in improving semiconductor quality. Wafer inspection equipment identifies physical flaws (foreign substances known as particles) and pattern defects on wafers, as well as the defect's position coordinates (X, Y). A wafer's form and function are both affected by major flaws. Some defects that are obvious are dislocation loops, cracks, straight dislocations, extrinsic defects, interstitial defects, vacancy defects, uneven thickness, and Frenkel defects.
Wafer inspection compares the thickness, pattern, and general quality of wafers fabricated from various types of materials. Quartz and glass are the most common materials used. The quality of the wafers is checked using a variety of techniques. Many businesses handle all aspects of wafer inspection in-house. Some companies, on the other hand, have professional inspectors on staff who undertake this inspection. Wafer inspection equipment is used to detect potential faults in wafers made of lead, cadmium, or other metals in their flat state. Each of these has its own inspection process. Non-patterned wafer inspection, which detects defects where the wafer thickness is less than 0.35 mm, and conventional wafer inspection, which detects faults on every side of the wafer, are two common inspection methods.
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